WAFER BONDED GAN MONOLITHIC INTEGRATED CIRCUITS AND METHODS OF MANUFACTURE OF WAFER BONDED GAN MONOLITHIC INTEGRATED CIRCUITS

摘要

Wafer bonded GaN monolithic integrated circuits and methods of manufacture of wafer bonded GaN monolithic integrated circuits and their related structures for electronic and photonic integrated circuits and for multi-functional integrated circuits, are described herein. Other embodiments are also disclosed herein.