首页> 外国专利> SELECTIVE ETCHES FOR REDUCING CONE FORMATION IN SHALLOW TRENCH ISOLATIONS

SELECTIVE ETCHES FOR REDUCING CONE FORMATION IN SHALLOW TRENCH ISOLATIONS

机译:减少浅沟槽隔离中锥体形成的选择性蚀刻

摘要

Techniques of fabricating shallow trench isolation structures that reduce or minimize the number of trench cones during the formation of shallow trenches. The disclosed techniques introduce separate etch steps for etching shallow trenches with small feature dimensions and for etching shallow trenches with large feature dimensions. As an example, the disclosed techniques involve etching a first shallow trench in a first region of a substrate with a first etching parameter, and etching a second shallow trench in a second region of a substrate with a second etching parameter different from the first etching parameter. Among other things, the etching parameter may include an etching selectivity ratio of silicon to an etch retardant that contributes to cone formations. Because of the separate etch steps, the disclosed techniques allow the sidewall slopes between the first and second shallow trenches to be within a few degrees of deviation.
机译:制造在浅沟槽形成期间减少或最小化沟槽锥数量的浅沟槽隔离结构的技术。所公开的技术引入了分开的蚀刻步骤,以蚀刻具有小特征尺寸的浅沟槽和用于蚀刻具有大特征尺寸的浅沟槽。作为示例,所公开的技术包括利用第一蚀刻参数在基板的第一区域中蚀刻第一浅沟槽,以及利用不同于第一蚀刻参数的第二蚀刻参数在基板的第二区域中蚀刻第二浅沟槽。 。其中,蚀刻参数可以包括硅与蚀刻剂的蚀刻选择性比,这有助于形成锥体。由于分开的蚀刻步骤,所公开的技术允许第一浅沟槽和第二浅沟槽之间的侧壁斜度在几个偏差度之内。

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