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SELECTIVE ETCHES FOR REDUCING CONE FORMATION IN SHALLOW TRENCH ISOLATIONS

机译:减少浅沟槽隔离中锥体形成的选择性蚀刻

摘要

To fabricate shallow trench isolation structures that reduce or minimize a number of trench cones during the formation of shallow trenches, separate etch steps etch shallow trenches with small feature dimensions and shallow trenches with large feature dimensions. For example, the a first shallow trench is etched in a first region of a substrate with a first etching parameter (316), and a second shallow trench is etched in a second region of a substrate with a second etching parameter different from the first etching parameter (326). The etching parameter may include an etching selectivity ratio of silicon to an etch retardant that contributes to cone formations. Because of the separate etch steps (316, 326), the sidewall slopes between the first and second shallow trenches may be within a few degrees of deviation.
机译:为了制造在浅沟槽形成期间减少或最小化沟槽锥的数量的浅沟槽隔离结构,单独的蚀刻步骤蚀刻具有小特征尺寸的浅沟槽和具有大特征尺寸的浅沟槽。例如,以第一蚀刻参数在衬底的第一区域中蚀刻第一浅沟槽(316),并且以不同于第一蚀刻的第二蚀刻参数在衬底的第二区域中蚀刻第二浅沟槽。参数(326)。蚀刻参数可以包括硅与有助于锥体形成的蚀刻延迟剂的蚀刻选择性比。由于分开的蚀刻步骤(316、326),第一浅沟槽和第二浅沟槽之间的侧壁倾斜可以在几个偏差度之内。

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