首页> 外国专利> Pulsed laser anneal process for transistor with partial melt of a raised source-drain

Pulsed laser anneal process for transistor with partial melt of a raised source-drain

机译:具有凸起的源极-漏极熔体的晶体管的脉冲激光退火工艺

摘要

A non-planar transistor including partially melted raised semiconductor source/drains disposed on opposite ends of a semiconductor fin with the gate stack disposed there between. The raised semiconductor source/drains comprise a super-activated dopant region above a melt depth and an activated dopant region below the melt depth. The super-activated dopant region has a higher activated dopant concentration than the activated dopant region and/or has an activated dopant concentration that is constant throughout the melt region. A fin is formed on a substrate and a semiconductor material or a semiconductor material stack is deposited on regions of the fin disposed on opposite sides of a channel region to form raised source/drains. A pulsed laser anneal is performed to melt only a portion of the deposited semiconductor material above a melt depth.
机译:一种非平面晶体管,包括部分熔化的凸起的半导体源极/漏极,其设置在半导体鳍片的相对端上,并且栅极堆叠设置在其间。凸起的半导体源极/漏极包括在熔体深度以上的超活化掺杂剂区域和在熔体深度以下的超活化掺杂剂区域。超活化的掺杂剂区域具有比活化的掺杂剂区域更高的活化的掺杂剂浓度和/或在整个熔体区域中具有恒定的活化的掺杂剂浓度。在衬底上形成鳍,并且将半导体材料或半导体材料叠层沉积在鳍的布置在沟道区的相对侧上的区域上,以形成凸起的源极/漏极。进行脉冲激光退火以仅熔化超过熔化深度的一部分沉积的半导体材料。

著录项

  • 公开/公告号US10170314B2

    专利类型

  • 公开/公告日2019-01-01

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US201615246468

  • 申请日2016-08-24

  • 分类号H01L21/268;H01L29/417;H01L21/265;H01L29/78;H01L29/66;H01L29/08;H01L29/10;H01L29/165;H01L21/324;

  • 国家 US

  • 入库时间 2022-08-21 12:04:57

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