首页> 外文期刊>Journal of the Korean Physical Society >High-Speed and Low-Temperature Atmospheric Photo-Annealing of Large-Area Solution-Processed IGZO Thin-Film Transistors by Using Programmable Pulsed Operation of Xenon Flash Lamp
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High-Speed and Low-Temperature Atmospheric Photo-Annealing of Large-Area Solution-Processed IGZO Thin-Film Transistors by Using Programmable Pulsed Operation of Xenon Flash Lamp

机译:通过使用氙闪光灯的可编程脉冲操作,高速和低温大气照射大型溶液处理的IGZO薄膜晶体管

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摘要

An efficient photo-annealing approach for high-performance solution-processed metal-oxide thin film transistors (TFTs) was demonstrated by using programmable pulse operation of xenon flash lamp. The flash lamp annealing (FLA) process could offer not only low-temperature (approximate to 100 degrees C) processing but also ultra-fast annealing speed of the order of seconds under air ambient conditions. Solution-processed amorphous indium-gallium-zinc-oxide (-IGZO) TFTs implemented by the FLA process typically exhibited much improved electrical performance such as saturation mobility of >10.8 cm(2)V(-11)s(-1), ION/IOPP of >10(8), and subthreshold slope of as steep as 0.24 V/dec. X-ray photoelectron spectroscopy analysis of a-IGZO films indicates that the FLA can provide sufficient activation energy for rapid formation of solid a-IGZO bonds within 30 s. The high-quality metal-oxide films achieved by an atmospheric and low temperature FLA method may represent a significant advance for scalable fabrication of flexible and printed metal-oxide electronics.
机译:通过使用氙闪光灯的可编程脉冲操作,证明了高性能溶液加工金属氧化物薄膜晶体管(TFT)的有效光退火方法。闪光灯退火(FLA)工艺不仅提供低温(近似为100摄氏度)处理,而且提供空气环境条件下秒针的超快速退火速度。由FLA工艺实现的溶液加工的无定形铟 - 镓 - 氧化锌(-igZo)TFT通常呈现出大量改善的电气性能,例如> 10.8cm(2)V(-11),离子的饱和迁移率。 / 10(8)的Iopp,以及较陡的亚阈值斜率为0.24 v / dec。 A-IgZO薄膜的X射线光电子能谱分析表明FLA可以提供足够的活化能量,以在30秒内快速形成固体A-IgZO键。通过大气和低温FLA方法实现的高质量金属氧化物膜可以代表柔性和印刷金属氧化物电子的可伸缩制造的显着提前。

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