Photosensitive resin composition, the soldering resist film using this photosensitive resin composition, a flexible printed wiring board, and an image display apparatus

摘要

This invention provides the photosensitive resin composition which can obtain the dry resist film excellent in the migration resistance and storage stability of the thickness direction. The photosensitive resin composition of this invention contains the photosensitive prepolymer which has a carboxyl group and ethylenically unsaturated group, a photoinitiator, and a thermosetting agent, The thermosetting agent is a formula (protected by the amino group in which a carbodiimide group dissociates at the temperature of 80 degreeC or more). It is a polycarbodiimide compound represented by 1), The polycarbodiimide compound has a weight average molecular weight 300-3000, and carbodiimide equivalent weight is 150-600. (In formula (1), R ¹ , R ² , X ¹ , X ² and n are the same as the definition described in the specification, respectively.)