首页> 外国专利> METHOD OF DETERMINATION OF TRANSIENT THERMAL RESISTANCE OF CRYSTAL-HOUSING AND THERMAL RESISTANCE OF CRYSTAL-HOUSING IN THE STATE OF HEAT EQUILIBRIUM OF TRANSISTORS WITH FIELD CONTROL

METHOD OF DETERMINATION OF TRANSIENT THERMAL RESISTANCE OF CRYSTAL-HOUSING AND THERMAL RESISTANCE OF CRYSTAL-HOUSING IN THE STATE OF HEAT EQUILIBRIUM OF TRANSISTORS WITH FIELD CONTROL

机译:现场控制法测定晶体的瞬态热阻和晶体的热阻状态的方法

摘要

FIELD: measuring equipment.;SUBSTANCE: invention relates to measurement of thermal parameters of power electronics components and can be used to determine transient thermal resistance of crystal-housing ZThJC (t) and heat resistance of crystal-housing in state of thermal equilibrium of RThJC transistors with field control, in particular, bipolar transistors with insulated gate (IGBT) and field-effect transistors with isolated gate (MOSFET) to control their quality. According to the disclosed method, the tested transistor is heated by direct current with the condition that a known constant power is detected in the transistor structure. On the heating interval, temperature dependences of the housing and the temperature sensitive parameter are obtained from the heating time, wherein the temperature sensitive parameter is voltage at the gate of the tested transistor. Heating is stopped when the preset temperature of the housing is reached. After a time interval of at least 2τ, where τ is a crystal-housing thermal constant value, at the natural cooling interval, periodic measuring pulses of electric current are periodically transmitted through the structure of the transistor under the condition that constant power is selected in the transistor structure, which is equal to the constant power value allocated in the transistor structure on the heating interval, duration and porosity of which minimally affect thermal processes. During each measurement pulse of electric current simultaneous measurement and storage of housing temperature and temperature-sensitive parameter. Method includes finding function of interrelation of crystal temperature and temperature-sensitive parameter and calculating transient thermal resistance of chip-housing ZThJC(t), determining the thermal resistance of the crystal-housing in the thermal equilibrium state RThJC of the tested transistor equal to the value ZThJC(t) at the constant section.;EFFECT: high accuracy of determining transient thermal resistance of the crystal-housing ZThJC(t) and thermal resistance of the crystal-housing in a state of thermal equilibrium of RThJC transistors with field control.;1 cl, 2 dwg
机译:技术领域:本发明涉及电力电子部件的热参数的测量,并且可以用于确定晶体外壳Z ThJC (t)的瞬态热阻和晶体外壳的热阻。带有场控制的R ThJC 晶体管处于热平衡状态,特别是带有绝缘栅(IGBT)的双极晶体管和带有隔离栅(MOSFET)的场效应晶体管以控制其质量。根据所公开的方法,以在晶体管结构中检测到已知的恒定功率为条件,通过直流电加热被测试的晶体管。在加热间隔上,从加热时间获得外壳的温度依赖性和温度敏感参数,其中温度敏感参数是被测晶体管的栅极处的电压。当达到外壳的预设温度时,停止加热。在至少2τ的时间间隔(其中τ是晶体外壳的热常数值)之后,在自然冷却间隔下,在选择恒定功率的条件下,周期性地将电流的周期性测量脉冲传输通过晶体管的结构。该晶体管结构等于在加热间隔,持续时间和孔隙率上对晶体管结构分配的恒定功率值,该恒定功率值对热处理的影响最小。在每个电流脉冲测量期间,同时测量并存储外壳温度和温度敏感参数。该方法包括找到晶体温度和温度敏感参数的相互关系函数,并计算芯片外壳Z ThJC (t)的瞬态热阻,确定处于热平衡状态的晶体外壳的热阻。被测晶体管的R ThJC 等于恒定部分的值Z ThJC (t);效果:高精度确定晶体外壳Z的瞬态热阻 ThJC (t)和具有场控制的R ThJC 晶体管在热平衡状态下晶体外壳的热阻; 1 cl,2 dwg

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