Estimation of interface thermal resistance and thermal conductivity using an inverse heat transfer procedure.

摘要

Experimental and computational techniques were devised to facilitate estimation of interface thermal resistance at solid interfaces, as well as the interface thermal conductivity at near-melting point temperatures.;The early stages of melting and/or dissolution to liquid to metals or slags involves the formation and melting back of a shell composed of a solidified liquid. This constitutes a moving boundary problem that is further complicated by evidence of an interface thermal resistance. It is during this period that a thermal resistance exists at the addition-shell interface; an interface thermal resistance exploited by the techniques herein.;Data, collected from experiments, was used as input to a model that solves the inverse heat conduction problem in terms of a resistance estimate. Results for a variety of metal-metal and metal-oxide combinations have shown a relationship between the estimated thermal resistance and the mismatch of thermal expansion coefficients and thermal conductivities of the interface materials.;The technique for estimating thermal conductivity was derived from the ability to estimate interface thermal resistance. By utilizing two thermocouples at different radial positions in the shell, two interface thermal resistance estimates were performed. Differing magnitudes of thermal resistance were attained owing to the thermal conductivity of the measurable layer of shell between the thermocouples.;Interface thermal resistance magnitudes were in the order of 10