Apparatus and method for setting the soldering position of a soldering punch of a Schöpflötanlage

摘要

Measuring device (1) for determining the soldering position of a soldering punch (24) of a potting system (21) with a contour plate (31) comprising: - at least one base plate (2), - at least one spacer (3), - at least one touch plate (7), the liftable in a Z-axis (5) of the base plate (2) is supported, and- at least one probe (8), - wherein the base plate (2) by means of the spacers (3) is arranged, parallel and spaced from the contour plate ( 31) to be arranged, - wherein the touch plate (7) is adapted to rest on the contour plate (31), and - wherein the probe (8) determines the distance between the base plate (2) and the touch plate (7).