CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, PRINTED WIRING BOARD, AND ELECTRONIC COMPONENT

摘要

To provide a curable resin composition which satisfies performance such as high adhesion, high resolution, high insulation reliability (HAST resistance) and high crack resistance (TCT resistance) required for a solder resist, prevents failures due to delamination and chipping in a dicing step by a process for dicing the board into pieces in a wafer level package, in other words, has high chipping resistance.SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) an epoxy resin, (C) at least one defoaming agent or leveling agent selected from a silicon and an acrylic copolymer and (D) an inorganic filler, in which (B) the epoxy resin contains a liquid non-aromatic epoxy resin having an epoxy equivalent of 180 g/eq. or less.SELECTED DRAWING: None