首页> 外文期刊>Journal of Industrial Ecology >Introducing Biobased Materials into the Electronics Industry Developing a Lignin-based Resin for Printed Wiring Boards
【24h】

Introducing Biobased Materials into the Electronics Industry Developing a Lignin-based Resin for Printed Wiring Boards

机译:将生物基材料引入电子行业开发用于印刷线路板的木质素基树脂

获取原文
获取原文并翻译 | 示例
           

摘要

Lignin, a biopolymer formed in the cell walls of plants, is a by-product of paper manufacturing. In research at IBM, it was incorported into a resin used in the fabrication of printed wiring boars (PWB) for the microelectronics industry. The resin and hysical and electrical properties similar t othose of current laminate resins. PWBs fabricated from the lignin-based resin passed most of the standard physical, electrial, and reliabiity tests for an "FR4"-grade laminate. A comparison of the lignin-based resin and current resins via life-cyclic assessment indicated up to 40% lower energy consumption for the biobased resin.Large-scale manufacture of lignin-based resins would require an inexpensive source of lignin with low ionic contamination.
机译:木质素是植物细胞壁中形成的生物聚合物,是造纸的副产品。在IBM的研究中,它与用于微电子行业的印刷线路板(PWB)制造中使用的树脂不相上下。该树脂以及与目前的层压树脂的水硬性和电性能相似。由木质素基树脂制成的PWB通过了“ FR4”级层压板的大多数标准物理,电气和可靠性测试。通过生命周期评估将木质素基树脂与当前树脂进行比较,表明生物基树脂的能耗降低了40%。大规模生产木质素基树脂将需要廉价的木质素来源,且需要低离子污染。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号