NOVEL PHOSPHORUS ATOM-CONTAINING EPOXY RESIN, PRODUCTION METHOD OF THE SAME, CURABLE RESIN COMPOSITION, CURED MATERIAL THEREOF, RESIN COMPOSITION FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, RESIN COMPOSITION FOR FLEXIBLE WIRING BOARD, RESIN COMPOSITION FOR SEMICONDUCTOR SEALING MATERIAL, AND RESIN COMPOSITION FOR INTERLAYER INSULATING MATERIAL FOR BUILD-UP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide: a novel phosphorus atom-containing epoxy resin excellent in solvent solubility, and excellent in heat resistance and flame retardancy of a cured material thereof; a method for producing the epoxy resin productively and industrially; a curable resin composition excellent in solvent solubility, and excellent in heat resistance of a cured material thereof, and a cured material thereof; and a resin composition for a printed wiring board, using the phosphorus atom-containing epoxy resin; a printed wiring board; a resin composition for a flexible wiring board; a resin composition for a semiconductor sealing material; and a resin composition for an interlayer insulating material for a build-up substrate.;SOLUTION: An aromatic aldehyde (a1) having an alkoxy group as a substituent on the aromatic nucleus and an organophosphorus compound (a2) having a P-H group or a P-OH group in the molecular structure are made to react with each other; and then, the obtained reaction product is caused to react with a polyfunctional phenol compound (a3) to obtain a phosphorus atom-containing phenol compound (), which is then caused to react with a polyfunctional epoxy resin () to make the phosphorus atom-containing epoxy resin.;COPYRIGHT: (C)2012,JPO&INPIT