METHOD FOR PRODUCING PHOSPHORUS ATOM-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION, ITS CURED PRODUCT, RESIN COMPOSITION FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, RESIN COMPOSITION FOR FLEXIBLE WIRING BOARD, RESIN COMPOSITION FOR SEMICONDUCTOR SEALING MATERIAL, AND RESIN COMPOSITION FOR INTERLAYER INSULATION MATERIAL FOR BUILDUP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for industrially producing a phosphorus atom-containing epoxy resin excellent in solvent solubility and heat resistance of the cured product in good productivity; a curable resin composition excellent in solvent solubility and heat resistance of the cured product and its cured product; and a resin composition for a printed wiring board, a printed wiring board, a resin composition for a flexible wiring board, a resin composition for a semiconductor sealing material, and a resin composition for an interlayer insulation material for a buildup substrate, each obtained by using the phosphorus atom-containing epoxy resin.;SOLUTION: This method for producing the phosphorus atom-containing epoxy resin comprises: reacting an aromatic aldehyde (a1) having an alkoxy group as a substituent group on the aromatic nucleus and an organophosphorus compound (a2) having a P-H group or P-CH group in the molecular structure; then reacting the obtained reaction product with phenol (a3) to obtain a phosphorus atom-containing phenol compound; and then reacting the obtained phosphorus atom-containing phenol compound with epihalohydrin.;COPYRIGHT: (C)2012,JPO&INPIT