an epoxy resin (A) represented by the following formula (1); anda cyanate compound (B),; embedded image wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15. "/> Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board
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Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board

机译:树脂组合物,预浸料,覆金属箔的层压板,树脂片和印刷电路板

摘要

A resin composition containing:an epoxy resin (A) represented by the following formula (1); anda cyanate compound (B),; embedded image wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15.
机译:树脂组合物,其包含: 由下式(1)表示的环氧树脂(A);和 一种氰酸盐化合物(B) ; “嵌入式图像” 其中Ar表示多环芳香族基团,R表示氢原子或甲基,G表示缩水甘油基,n表示0至15的整数。 / ListItem>

著录项

  • 公开/公告号US10703855B2

    专利类型

  • 公开/公告日2020-07-07

    原文格式PDF

  • 申请/专利权人 MITSUBISHI GAS CHEMICAL COMPANY INC.;

    申请/专利号US201716079353

  • 发明设计人 SHOTA KOGA;DAISUKE UEYAMA;KENTARO TAKANO;

    申请日2017-09-01

  • 分类号C08G59/06;C08J5/24;C08L63;B32B15/092;C08G59/40;C08G59/32;H05K1/03;C08K5/315;B32B15/08;C08K5/29;H05K3/02;

  • 国家 US

  • 入库时间 2022-08-21 11:29:50

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