MECHANICAL ANALYSIS METHOD OF MEMS DOUBLE-END FIXED BEAM STRUCTURE UNDER BENDING CONDITION OF FLEXIBLE SUBSTRATE

摘要

Provided is a mechanical analysis method of an MEMS double-end fixed beam structure under bending condition of a flexible substrate. The invention aims to provide an estimation method for a change rule of mechanical property parameters of the MEMS double-end fixed beam structure under the bending condition of the flexible substrate. Two steps are mainly adopted to model the bending characteristics of the MEMS double-end fixed beam structure under the bending condition of the flexible substrate, to obtain an analysis model of the influence of the deformation of the MEMS double-end fixed beam structure on the mechanical property of a device. Firstly, establishing a deformation coupling model on the basis of double deformation of the MEMS double-end fixed beam structure and the flexible substrate, and extracting key structural parameter change amounts between the MEMS double-end fixed beam structure and the flexible substrate. Secondly, on the basis of the bending characteristic model of the MEMS double-end fixed beam structure, obtaining the deformation amounts of the double deformation of the MEMS double-end fixed beam structure and the flexible substrate and the stress introduction amounts in the MEMS double-end fixed beam structure. On the basis of said parameters, the mechanical model of the MEMS double-end fixed beam structure is reconstructed, and the influence of bending deformation on the mechanical property of the MEMS double-end fixed beam structure is analyzed. In order to fill the domestic and foreign research blank of the flexible device model of the MEMS double-end fixed beam structure, the mechanical analysis method of the MEMS double-end fixed beam structure taking the influence of the biaxial residual stress of the MEMS double-end fixed beam structure into account in a complex environment space containing the double deformation model of the the MEMS double-end fixed beam structure and the flexible substrate is provided.