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MECHANICAL ANALYSIS METHOD FOR MEMS V-BEAM STRUCTURE UNDER BENDING CONDITION OF FLEXIBLE SUBSTRATE
MECHANICAL ANALYSIS METHOD FOR MEMS V-BEAM STRUCTURE UNDER BENDING CONDITION OF FLEXIBLE SUBSTRATE
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机译:柔性基板弯曲条件下MEMS V型梁结构的力学分析方法
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摘要
Disclosed in the present invention is a mechanical analysis method for a MEMS V-beam structure under a bending condition of a flexible substrate. The purpose is to provide a method for estimating a parameter variation law of mechanical properties of a V-beam structure under a bending deformation condition of a flexible substrate. The present invention mainly adopts two steps to deal with the modeling of bending characteristics of the MEMS V-beam structure under the bending condition of the flexible substrate, thereby obtaining an analytical model for the influence of the deformation of the V-beam structure on the mechanical properties of a device. One is establishing a deformation coupling model based on double deformation of the MEMS V-beam structure and the flexible substrate, and the other is obtaining a deformation amount of V-beam structure/substrate double deformation on the basis of the bending characteristic model of the MEMS V-beam structure. Based on the above parameters, the mechanical model of the MEMS V-beam structure is reconstructed, and the influence of the bending deformation on the mechanical properties of the V-beam structure is analyzed. In order to fill the gap in the research on flexible device models of MEMS V-beam structures at home and abroad, the present invention provides a mechanical analysis method for a MEMS V-beam structure comprising a double deformation model of the V-beam structure and a flexible substrate based on a complex environment space.
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