POLISHING LIQUID, CONCENTRATE OF SAME, METHOD FOR PRODUCING POLISHED ARTICLE USING POLISHING LIQUID, AND POLISHING METHOD OF SUBSTRATE USING POLISHING LIQUID

摘要

This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The average particle diameter D₅₀ of the ceria abrasive grains is from 120 nm to 550 nm (inclusive). The average particle diameter D₅₀ of the silica abrasive grains is from 40 nm to 140 nm (inclusive). The mass ratio of the silica abrasive grains to the ceria abrasive grains in the polishing liquid, namely the value of (silica abrasive grains)/(ceria abrasive grains) is from 4/100 to 150/100 (inclusive). The content of the ceria abrasive grains in the polishing liquid is from 0.25% by mass to 2.5% by mass (inclusive). The content of the silica abrasive grains in the polishing liquid is from 0.1% by mass to 1.5% by mass (inclusive).