A Study of CMP Polishing Technology and Polishing Liquid in Preparation of Microelectronics Devices

摘要

The invention fruits of Institute of Microelectronics in hebei University of Technology have been introduced, such as 15～20nm alkalescence polishing liquid used for Cu CMP, alkalescence polishing liquid used for obstruction CMP, 120nm hydrosol polishing liquid, alkalescence polishing liquid used by interconnection plug (W or Al) CMP, polishing liquid used for silicon substrate in ULSI and cutting liquid, grind liquid, edge profiling liquid, technology of stress controling.