Researchers Submit Patent Application, 'Cmp Polishing Liquid, Method for Polishing Substrate, and Electronic Component', for Approval

摘要

2013 MAR 27 (VerticalNews) -- By a News Reporter-Staff News Editor at Journal of Engineering -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Shinoda, Takashi (Ibaraki, JP); Enomoto, Kazuhiro (Ibaraki, JP); Akutsu, Toshiaki (Ibaraki, JP), filed on November 6, 2012, was cleared for further review on March 14, 2013.