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METHOD FOR MANUFACTURING TOP LIGHT-EMITTING TYPE INDIUM GALLIUM ZINC OXIDE THIN FILM TRANSISTOR DEVICE

机译:制造顶部发光型铟镓锌氧化物薄膜晶体管器件的方法

摘要

A method for manufacturing a light-emitting type indium gallium zinc oxide thin film transistor device. The method comprises a first photolithography step (S01), a second photolithography step (S02), a gate insulating layer formation step (S03), a third photolithography step (S04), a source via-hole formation step (S05), an indium gallium zinc oxide active layer exposure step (S06), a source/drain formation step (S07), a planarization layer formation step (S08), a fourth photolithography step (S09), a fifth photolithography step (S10) and a sixth photolithography step (S11). A gate electrode and a source/drain electrode are prepared using a polyimide electrode barrier isolation column (61), and the source/drain electrode and the gate electrode can be directly formed by the electrode barrier isolation column (61), such that three photomasks are reduced to one. Moreover, polyimide, as a gate insulating layer (50), can increase channel current density, thereby simplifying the complexity of the manufacturing method and improving the production efficiency.
机译:一种发光型铟镓锌氧化物薄膜晶体管器件的制造方法。该方法包括第一光刻步骤(S01),第二光刻步骤(S02),栅绝缘层形成步骤(S03),第三光刻步骤(S04),源通孔形成步骤(S05),铟镓氧化锌活性层暴露步骤(S06),源/漏形成步骤(S07),平坦化层形成步骤(S08),第四光刻步骤(S09),第五光刻步骤(S10)和第六光刻步骤(S11)。使用聚酰亚胺电极阻挡隔离柱(61)制备栅电极和源/漏电极,并且可以通过电极阻挡隔离柱(61)直接形成源/漏电极和栅电极,从而形成三个光掩模。减少为一。此外,作为栅极绝缘层(50)的聚酰亚胺可以增加沟道电流密度,从而简化了制造方法的复杂性并提高了生产效率。

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