首页> 外国专利> ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN FILM, PATTERN-FORMING METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN FILM, PATTERN-FORMING METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

机译:活性光敏或辐射敏感树脂组合物,活性光敏或辐射敏感树脂膜,图案形成方法和电子设备生产方法

摘要

Provided is an active light-sensitive or radiation-sensitive resin composition, etc., that is capable of forming a pattern having an extremely excellent rectangular shape in the cross-section thereof, when forming a pattern having an extremely high cross-section aspect ratio from a thick active light-sensitive radiation-sensitive film. This active light-sensitive or radiation-sensitive resin composition includes: a resin (A) having increased polarity due to the use of acid; a compound (B) generating acid as a result of irradiation by active light or radiation; and a compound (C) indicated by a specific structure and having a molecular weight of at least 220.
机译:提供一种活性光敏或放射线敏感性树脂组合物等,当形成具有高横截面纵横比的图案时,其能够形成其横截面具有非常优异的矩形形状的图案。由厚的有源光敏辐射敏感薄膜制成。该活性的光敏或放射线敏感性树脂组合物包括:由于使用酸而具有增加的极性的树脂(A);和化合物(B)由于活性光或辐射的照射而产生酸; (C)具有特定结构且分子量至少为220的化合物(C)。

著录项

  • 公开/公告号WO2020202944A1

    专利类型

  • 公开/公告日2020-10-08

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORPORATION;

    申请/专利号WO2020JP08266

  • 申请日2020-02-28

  • 分类号C07D207/16;C07D211/60;C07D211/62;C07D405/12;C07D411/12;C07D493/14;G03F7/004;G03F7/038;G03F7/039;G03F7/20;C07D295/205;

  • 国家 WO

  • 入库时间 2022-08-21 11:09:04

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