首页> 外国专利> MANUFACTURING METHOD OF FREE STANDING GALLIUM NITRIDE USING ELECTROCHEMICAL ETCHING METHOD AND PHOTOELECTRIC ELECTRODE FOR WATER DECOMPOSITION GYDROGEN PRODUCTION INCLUDING THE SAME

MANUFACTURING METHOD OF FREE STANDING GALLIUM NITRIDE USING ELECTROCHEMICAL ETCHING METHOD AND PHOTOELECTRIC ELECTRODE FOR WATER DECOMPOSITION GYDROGEN PRODUCTION INCLUDING THE SAME

机译:利用电化学刻蚀法和光电子法生产游离型氮化镓的方法包括水分解法

摘要

The bending of the free standing gallium nitride substrate can be controlled by etching and planarizing the N-face of the gallium nitride substrate in the form of a convex using an electrochemical etching method capable of fast etching and selective etching. Disclosed is a method for manufacturing a free standing gallium nitride substrate using an electrochemical etching method and a photoelectrode for producing hydrolysis hydrogen containing the same. A method of manufacturing a free standing gallium nitride substrate using an electrochemical etching method according to the present invention includes: (a) preparing a gallium nitride substrate in a convex form; And (b) etching and planarizing the N-face of the gallium nitride substrate by an electrochemical etching method, wherein in the step (b), the etching is performed at an applied voltage condition of 20 to 40V. Characterized in that it is carried out.
机译:通过使用能够快速蚀刻和选择性蚀刻的电化学蚀刻方法,以凸面形式蚀刻和平坦化氮化镓衬底的N面,可以控制独立式氮化镓衬底的弯曲。公开了一种使用电化学蚀刻方法制造自立氮化镓衬底的方法以及用于产生包含其的水解氢的光电极。根据本发明的利用电化学蚀刻方法制造自立式氮化镓衬底的方法包括:(a)制备凸形的氮化镓衬底;并且(b)通过电化学蚀刻方法蚀刻并平坦化氮化镓衬底的N面,其中在步骤(b)中,在20至40V的施加电压条件下进行蚀刻。其特点是进行。

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