- STICTION-FREE DRYING PROCESS WITH CONTAMINANT REMOVAL FOR HIGH-ASPECT RATIO SEMICONDUCTOR DEVICE STRUCTURES

摘要

Embodiments of the present invention generally relate to a substrate processing apparatus configured to perform a method of cleaning a substrate, and a method of cleaning a substrate. More specifically, embodiments of the present invention relate to a method of cleaning a substrate in a manner that reduces or eliminates the negative effects of line stiction between semiconductor device features. Other embodiments of the present invention relate to a substrate processing apparatus that allows for cleaning a substrate in a manner that reduces or eliminates line stiction between semiconductor device features formed on the substrate.