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- STICTION-FREE DRYING PROCESS WITH CONTAMINANT REMOVAL FOR HIGH-ASPECT RATIO SEMICONDUCTOR DEVICE STRUCTURES
- STICTION-FREE DRYING PROCESS WITH CONTAMINANT REMOVAL FOR HIGH-ASPECT RATIO SEMICONDUCTOR DEVICE STRUCTURES
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机译:- 无抗菌干燥过程,具有污染物去除高纵横比半导体器件结构
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摘要
Embodiments of the present invention generally relate to a method of cleaning a substrate, and a substrate processing apparatus configured to perform the method for cleaning a substrate. More particularly, embodiments of the present invention relate to methods of cleaning a substrate in a manner that reduces or eliminates the negative effects of line stiction between semiconductor device features. Other embodiments of the present invention are directed to a substrate processing apparatus that allows cleaning of a substrate in a manner that reduces or eliminates line stiction between semiconductor device features formed on the substrate.
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