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Field-enhanced direct tunneling in ultrathin atomic-layer-deposition-grown Au-Al2O3-Cr metal-insulator-metal structures

机译:在超薄原子层沉积生长的au-al2O3-Cr金属 - 绝缘体 - 金属结构中的场增强直接隧穿

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摘要

Metal-insulator-metal structures based on ultrathin high-k dielectric films are underpinning a rapidly increasing number of devices and applications. Here, we report detailed electrical characterizations of asymmetric metal-insulator-metal devices featuring atomic layer deposited 2-nm-thick Al2O3 films. We find a high consistency in the current density as a function of applied electric field between devices with very different surface areas and significant asymmetries in the IV characteristics. We show by TEM that the thickness of the dielectric film and the quality of the metal-insulator interfaces are highly uniform and of high quality, respectively. In addition, we develop a model which accounts for the field enhancement due to the small sharp features on the electrode surface and show that this can very accurately describe the observed asymmetry in the current-voltage characteristic, which cannot be explained by the difference in work function alone.
机译:基于超薄高k介电膜的金属-绝缘体-金属结构正支撑着数量迅速增加的器件和应用。在这里,我们报告了不对称金属绝缘体金属器件的详细电学特征,这些器件具有原子层沉积的2nm厚Al2O3膜。我们发现,电流密度具有高度一致性,这是表面积之间差异很大且IV特性存在明显不对称性的器件之间施加的电场的函数。我们通过TEM显示介电膜的厚度和金属-绝缘体界面的质量分别非常均匀和高质量。另外,我们开发了一个模型,该模型考虑了由于电极表面上小的尖锐特征而导致的电场增强,并表明这可以非常准确地描述所观察到的电流-电压特性中的不对称性,这不能用功的差异来解释。独自发挥作用。

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