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On-chip data communication : analysis, optimization and circuit design

机译:片上数据通信:分析,优化和电路设计

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摘要

On-chip data communication is an active research area, as interconnects are rapidly becoming a speed, power and reliability bottleneck for digital CMOS systems. In this thesis, interconnects are analyzed and techniques and circuits are discussed that can improve their behavior for data communication.udIt is shown that the bandwidth of interconnects is either limited by their distributed RC behavior (for long interconnects), or by the skin-effect. The aggregate bandwidth per cross-sectional area can be optimized by choosing all cross-sectional dimensions roughly equal. The bandwidth of a single interconnect can be increased by using resistive (or resistive-inductive) receiver termination or capacitive transmitter termination. The crosstalk can be mitigated with twisted differential interconnects. With the aid of a symbol response analysis method, it is shown that simple equalization schemes are very effective to boost the achievable data rate, more so than multi-level signaling or band-pass modulation. udTo validate the concepts two demonstrator ICs were developed, both using 10mm long interconnects. The first chip, in a 130nm CMOS process, showed that a combination of pulse-width pre-emphasis, twisted interconnects and low-ohmic receiver termination can boost the data rate to 3Gb/s/ch (at 2pJ/bit), while a conventional transceiver reached only 0.55Gb/s/ch. The second test-chip, in 90nm CMOS, showed that a combination of a capacitive transmitter and a low-power sense-amplifier with DFE at the receiver can reduce the energy consumption to 0.28pJ/bit (at 2Gb/s), much lower than competing designs. udCircuit simulations show that a capacitive transmitter and a low-power sense amplifier can also be very effective as transceivers in a Network on Chip (NoC), with data rates in excess of 9Gb/s (at 130fJ/transition) over 2mm interconnects. Multiple transceivers can be connected back-to-back to create a source-synchronous transceiver-chain with a wave-pipelined clock, operating with 6σ offset reliability at 5 Gb/s.
机译:片上数据通信是一个活跃的研究领域,因为互连正在迅速成为数字CMOS系统的速度,功率和可靠性瓶颈。在本文中,对互连进行了分析,并讨论了可以改善其数据通信行为的技术和电路。 ud表明,互连的带宽受其分布式RC行为(对于长互连)或皮肤的限制。影响。可以通过选择所有大致相等的横截面尺寸来优化每个横截面的总带宽。可以通过使用电阻性(或电阻性-电感性)接收器端接或电容性发射器端接来增加单个互连的带宽。扭曲的差分互连可以缓解串扰。借助于符号响应分析方法,显示出简单的均衡方案非常有效地提高了可达到的数据速率,比多级信令或带通调制更有效。为了验证概念,开发了两个演示器IC,它们均使用10mm长的互连。第一个芯片采用130nm CMOS工艺,显示出脉冲宽度预加重,扭曲的互连和低欧姆接收器端接的组合可以将数据速率提高到3Gb / s / ch(2pJ / bit),而传统收发器仅达到0.55Gb / s / ch。第二个测试芯片采用90nm CMOS,表明电容式发射器和低功率感测放大器在接收器处结合DFE可以将能耗降低到0.28pJ / bit(在2Gb / s时),更低比竞争设计。电路仿真表明,电容式发射机和低功耗感测放大器也可以非常有效地用作片上网络(NoC)中​​的收发器,在2mm互连上的数据速率超过9Gb / s(130fJ /过渡)。可以将多个收发器背对背连接,以创建具有波形时钟的源同步收发器链,并以5 Gb / s的6σ偏移可靠性运行。

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    Schinkel Daniël;

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  • 年度 2011
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  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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