A greatly simplified method for fabricating poly(methyl methacrylate) (PMMA) separation microchips is introduced. The new protocol relies on UV-initiated polymerization of the monomer solution in an open mold under ambient pressure. Silicon microstructures are transferred to the polymer substrate by molding a methyl methacrylate solution in a sandwich (silicon master/Teflon spacer/glass plate) mold. The chips are subsequently assembled by thermal sealing of the channel and cover plates. The new fabrication method obviates the need for specialized replication equipment and reduces the complexity of prototyping and manufacturing. Variables of the fabrication process were assessed and optimized. The new method compares favorably with common fabrication techniques, yielding high-quality devices with well-defined channel and injection-cross structures, and highly smoothed surfaces. Nearly 100 PMMA chips were replicated using a single silicon master, with high chip-to-chip reproducibility (relative standard deviations of 1.5 and 4.7% for the widths and depths of the replicated channels, respectively). The relatively high EOF value of the new chips (2.12 x 10(-4) cm(2) x V(-1) x s(-1)) indicates that the UV polymerization process increases the surface charge and hence enhances the fluidic transport. The attractive performance of the new CE microchips has been demonstrated in connection with end-column amperometric and contactless-conductivity detection schemes. While the new approach is demonstrated in connection with PMMA microchips, it could be applied to other materials that undergo light-initiated polymerization. The new approach brings significant simplification of the process of fabricating PMMA devices and should lead to a widespread low-cost production of high-quality separation microchips.
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机译:介绍了一种大大简化的制造聚(甲基丙烯酸甲酯)(PMMA)分离微芯片的方法。新方案依赖于在环境压力下在敞口模具中紫外线引发的单体溶液聚合。通过在三明治模具(硅母模/特氟龙垫片/玻璃板)中模制甲基丙烯酸甲酯溶液,将硅微结构转移到聚合物基材上。随后通过热密封通道和盖板组装芯片。新的制造方法消除了对专用复制设备的需求,并降低了原型制作和制造的复杂性。评估并优化了制造过程中的变量。该新方法与常规制造技术相比具有优势,可以生产出具有清晰通道和注射交叉结构以及高度平滑表面的高质量器件。使用单个硅母盘可复制近100个PMMA芯片,具有很高的芯片间重复性(所复制通道的宽度和深度的相对标准偏差分别为1.5和4.7%)。新芯片的相对较高EOF值(2.12 x 10(-4)cm(2)x V(-1)x s(-1))表明UV聚合过程增加了表面电荷,从而增强了流体传输。新型CE微芯片的引人入胜的性能已与端柱电流法和非接触式电导率检测方案相结合证明。虽然这种新方法已在PMMA微芯片上得到了证明,但它可以应用于经历光引发聚合反应的其他材料。新方法极大地简化了PMMA器件的制造工艺,并应导致低成本高品质分离微芯片的生产。
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