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首页> 外文期刊>Lasers in engineering >Fabrication of Poly(methyl methacrylate) (PMMA) Microfluidic Chips Using CO2 Laser Beam Machining and Hot Bonding
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Fabrication of Poly(methyl methacrylate) (PMMA) Microfluidic Chips Using CO2 Laser Beam Machining and Hot Bonding

机译:使用CO2激光束加工和热粘合的聚(甲基丙烯酸甲酯)(PMMA)微流体芯片的制备

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摘要

A single, versatile fabrication method for producing microfluidic chips on poly(methyl methacrylate) (PMMA) substrates is described. First, we processed the microchannel using CO2 laser beam machining on the PMMA substrate. In this course the influence of laser power, scanning speed and focal distance on the processing quality of microchannel were investigated by orthogonal experiment. The experimental result shows that the greatest influence factor is focal distance. Based on the experiment, we found a set of optimal parameters to process the microchannel within the set parameters. Next, the substrate with the microchannels and the cover are combined using thermal bonding. Since the previous bonding technology has a low success rate, we have proposed a new bonding termed a pre-bonding technique for bonding chips. The principle of this technology is to first remove the material stress with low pressure, and then use high pressure bonding. Finally, the processing quality of the microchannel and the feasibility of the pre-bonding method were verified successfully by the mixed experiment. This study can help people pay attention to the effect of focal distance on the shape of microchannels when using CO2 laser beam machining to process microchannels.
机译:描述了一种用于在聚(甲基丙烯酸甲酯)衬底上产生微流体芯片的单一的通用制造方法(PMMA)衬底。首先,我们在PMMA基板上使用CO2激光束加工处理微通道。在本课程中,通过正交实验研究了激光功率,扫描速度和焦距对微通道的处理质量的影响。实验结果表明,最大的影响因素是焦距。基于实验,我们发现了一组最佳参数来处理集合参数内的微通道。接下来,使用热粘合来组合具有微通道和盖子的基板。由于先前的粘接技术成功率低,因此我们提出了一种新的粘合,称为粘合芯片的预粘合技术。该技术的原理是首先用低压去除材料应力,然后使用高压粘合。最后,通过混合实验成功地验证了微通道的处理质量和预粘接方法的可行性。本研究可以帮助人们注意使用CO2激光束加工过程微通道时的微通道形状的焦距对微通道形状的影响。

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