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Quantifying Asphalt Emulsion-Based Chip Seal Curing Times Using Electrical Resistance Measurements

机译:使用电阻测量量化基于沥青乳液的芯片密封固化时间

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摘要

Chip sealing typically consists of covering a pavement surface with asphalt emulsion into which aggregate chips are embedded. The asphalt emulsion cures through the evaporation of water, thus providing mechanical strength to adhere to the pavement while keeping the aggregate chips in place. The curing time for the chip seal depends on many factors, such as the asphalt emulsion and aggregate types, aggregate moisture content, emulsion and aggregate application rates, and environmental conditions (e.g., temperature, wind speed, relative humidity, and solar radiation). Currently, no field technique is available to quantify when sufficient mechanical strength has developed in the binder to allow traffic on a newly sealed roadway or to remove the surplus aggregate from a fresh chip seal through brooming. Instead such decisions are made by empirical factors that rely on the experience of field personnel.This study investigated the use of electrical resistance measurements to develop a quantitative method for determining the optimum curing time for chip seals. First, full frequency, two-point, uniaxial electrical impedance spectroscopy was used to characterize the electrical properties of asphalt emulsions and various asphalt emulsion-aggregate combinations. The laboratory test results suggest a relationship between the changes in the electrical resistance of an asphalt emulsion and the amount of curing that has occurred in the system. Additionally, standardized mechanical strength tests and full-scale field trials were conducted using a variety of materials. The electrical properties of the fresh seals were quantified using a handheld electrical device with a two-point probe to measure resistance. The findings suggest that chip seal systems gain significant mechanical strength when the initial electrical resistance measurement increases by a factor of 10. Finally, the implementation of the methodology for five full-scale chip seal projects in Indiana indicates that curing times for the chip seals range from 3.5 to 4.0 hours.
机译:碎屑密封通常包括用沥青乳液覆盖路面,并在其中嵌入骨料碎屑。沥青乳液通过水分蒸发而固化,从而提供机械强度以粘附到人行道上,同时将碎石保持在适当的位置。芯片密封的固化时间取决于许多因素,例如沥青乳液和骨料的类型,骨料的水分含量,乳液和骨料的施用率以及环境条件(例如温度,风速,相对湿度和太阳辐射)。当前,没有现场技术可用于量化粘合剂中何时已形成足够的机械强度,以允许在新密封的道路上通行或通过扫帚从新的芯片密封中清除多余的骨料。取而代之的是,这些决定是根据经验因素做出的,这些经验因素取决于现场人员的经验。本研究调查了电阻测量的使用,以开发一种定量方法来确定芯片密封的最佳固化时间。首先,使用全频两点单轴电阻抗光谱法来表征沥青乳液和各种沥青乳液-骨料组合的电性能。实验室测试结果表明,沥青乳液的电阻变化与系统中已发生的固化量之间存在关系。此外,还使用多种材料进行了标准化的机械强度测试和全面的现场试验。使用带有两点探针以测量电阻的手持式电气设备对新鲜密封的电气特性进行量化。研究结果表明,当初始电阻测量值增加10倍时,芯片密封系统将获得显着的机械强度。最后,印第安纳州五个全尺寸芯片密封项目的方法实施表明,芯片密封的固化时间范围从3.5到4.0小时。

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