首页> 外国专利> QUANTIFYING EMULSIFIED ASPHALT-BASED CHIP SEAL CURING TIMES USING ELECTRICAL PROPERTIES

QUANTIFYING EMULSIFIED ASPHALT-BASED CHIP SEAL CURING TIMES USING ELECTRICAL PROPERTIES

机译:利用电学性能量化基于乳化沥青的芯片密封时间

摘要

A method of determining moisture content in an emulsified asphalt-aggregate system is disclosed. The method includes: placing a first electrode in an emulsified asphalt-aggregate system (Mixture) at a first depth, placing a second electrode in the Mixture at a second depth, applying an alternating current (AC) signal between the first electrode and the second electrode, measuring impedance, determining the frequency which yields the minimum measured impedance, recording the minimum measured impedance, repeating the above steps at a predetermined time interval until the recorded minimum impedance is about 10 times of the first recorded minimum impedance, and alerting a user that the Mixture has sufficiently cured.
机译:公开了一种在乳化的沥青-骨料体系中测定水分含量的方法。该方法包括:将第一电极以第一深度放置在乳化沥青-骨料系统(混合物)中,将第二电极以第二深度放置在混合物中,在第一电极和第二电极之间施加交流(AC)信号电极,测量阻抗,确定产生最小测量阻抗的频率,记录最小测量阻抗,以预定的时间间隔重复上述步骤,直到记录的最小阻抗约为第一次记录的最小阻抗的10倍,并提醒用户混合物已充分固化。

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