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Raman spectroscopy characterization of diamond films on steel substrates with titanium carbide arc-plated interlayer

机译:拉曼光谱法表征具有碳化钛电弧镀层的钢基底上的金刚石膜

摘要

Diamond chemical vapour deposition (CVD) on steel represents a difficult task. The major problem is represented by large diffusion of carbon into steel at CVD temperatures. This leads to very low diamond nucleation and degradation of steel microstructure and properties. Recent work [R. Polini, F. Pighetti Mantini, M. Braic, M. Amar, W Ahmed, H. Taylor, Thin Solid Films 494 (2006) 116] demonstrated that well-adherent diamond films can be grown on high-speed steels by using a TiC interlayer deposited by the PVD-arc technique. The resulting multilayer (TiC/ diamond) coating had a rough surface morphology due to the presence of droplets formed at the substrate surface during the reactive evaporation of TiC. In this work, we first present an extensive Raman investigation of 2 mu m, 4 mu m and 6 mu m thick diamond films deposited by hot filament CVD on TiC interlayers obtained by the PVD-arc technique. The stress state of the diamond was dependent on both the films thickness and the spatial position of the coating on the substrate. In fact, on the top of TiC droplets, the stress state of the diamond was much lower than that of diamond in flatter substrate areas. These results showed that diamond films deposited on rough TiC interlayers exhibited a wide distribution of stress values and that very large compressive stress exists in the diamond film grown on flat regions of steel substrates with a TiC interlayer. Diamond films could accommodate stresses as large as 10 GPa without delamination.
机译:在钢上进行金刚石化学气相沉积(CVD)是一项艰巨的任务。主要问题是在CVD温度下碳大量扩散到钢中。这导致非常低的金刚石成核作用以及钢组织和性能的降低。最近的工作[R. Polini,F. Pighetti Mantini,M. Braic,M. Amar,W Ahmed,H.Taylor,Thin Solid Films 494(2006)116]证明,通过使用TiC可以在高速钢上生长附着良好的金刚石膜PVD-arc技术沉积的中间层。由于在TiC反应性蒸发过程中在基材表面形成了液滴,因此所得多层(TiC /金刚石)涂层具有粗糙的表面形态。在这项工作中,我们首先对通过热丝CVD在通过PVD电弧技术获得的TiC夹层上沉积的2微米,4微米和6微米厚的金刚石膜进行广泛的拉曼研究。金刚石的应​​力状态既取决于膜的厚度,又取决于基体上涂层的空间位置。实际上,在TiC小滴的顶部,金刚石的应​​力状态比在较平坦的基材区域中的金刚石的应​​力状态低得多。这些结果表明,沉积在粗糙的TiC中间层上的金刚石膜表现出较宽的应力值分布,并且在具有TiC中间层的钢基底的平坦区域上生长的金刚石膜中存在很大的压应力。金刚石膜可承受高达10 GPa的应力而不会分层。

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