首页> 外文OA文献 >Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Etching Technology for Printed Wiring Board Process.

【2h】

Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Etching Technology for Printed Wiring Board Process.

机译：特殊问题/最近印刷布线板表面整理的趋势和未来评论。印刷配线板工艺蚀刻技术。

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Toshio HAYASHI;
展开▼
作者单位

展开▼
年度 1993
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Substrate-induced coagulation of carbon black on gelatine-modified printed wiring board surfaces Part 1. Gelatine adsorption on to printed wiring board surfaces [J] . Bele M., Besenhard JO., Ribitsch V., Colloids and Surfaces, A. Physicochemical and Engineering Aspects . 1998,第1期

机译：基质诱导的明胶改性印刷电路板表面上炭黑的凝结第1部分。明胶吸附到印刷电路板表面上
2. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压动态平行度对多层印刷线路板差异的影响-多层印刷线路板精密粘合技术的研究IV
3. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压机动态平行性对多层印刷线板差异的影响 - 多层印刷配线板精确粘合技术研究IV
4. An Investigation Of The Effects Of Printed Wiring Board Surface Finish and Conformal Coating For Ball Grid Array Assembly [C] . Dave Hillman, Nicole Cavanah, Jamie Reinig, First Annual IPC SMEMA Council Electronics Assembly Process Exhibition and Conference APEX 2000, Mar 14-16, 2000, Long Beach, California . 2000

机译：印刷电路板表面光洁度和保形涂层对球栅阵列组件影响的研究
5. Recycling of electronic waste: Printed wiring boards. [D] . Luyima, Alex. 2013

机译：电子废物的回收：印刷线路板。
6. Screen-printed electrode produced by printed-circuit board technology. Application to Cancer Biomarker Detection by means of plastic antibody as sensing material [O] . Felismina T.C. Moreira, M. Judite M.S. Ferreira, José R.T. Puga, -1

机译：通过印刷电路板技术生产的丝网印刷电极。以塑料抗体为检测材料在癌症生物标志物检测中的应用
7. Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board. [O] . Takeshi MIURA, Masaru SEITA 1993

机译：特殊问题/最近印刷布线板表面整理的趋势和未来评论。印刷配线板的锡铅电镀技术。
8. Implementing Cleaner Printed Wiring Board Technologies: Surface Finishes. Design for the Environment Printed Wiring Board Project. [R] . 2000

机译：实施更清洁的印刷线路板技术：表面处理。环境印刷线路板项目设计。

Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Etching Technology for Printed Wiring Board Process.

著录项

引文网络

相似文献

相关主题

期刊订阅