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Effective reduction of interfacial traps in Al2O3/GaAs (001) gate stacks using surface engineering and thermal annealing

机译:使用表面工程和热退火的Al2O3 / GaAs(001)栅极堆叠的界面陷阱的有效减少

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摘要

To effectively passivate the technologically important GaAs (001) surfaces, in situ deposition of Al2O3 was carried out with molecular beam epitaxy. The impacts of initial GaAs surface reconstruction and post-deposition annealing have been systematically investigated. The corresponding interfacial state density (D-it) were derived by applying the conductance method at 25 and 150 degrees C on both p-type and n-type GaAs metal-oxide-semiconductor capacitors to establish the D-it spectra in proximity of the critical midgap region. We show that significant reduction of D-it near the midgap is achieved by applying an optimized thermal annealing on samples grown on a Ga-rich (4x6) reconstructed surface. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3488813]
机译:为了有效地钝化技术重要的GaAs(001)表面,原位沉积Al 2 O 3与分子束外延进行。初始GaAs表面重建和沉积后退火的影响已得到系统地研究。通过在P型和N型GaAs金属氧化物 - 半导体电容器上在25和150摄氏度下施加电导方法来得出相应的界面状态密度(D-IT),以在附近建立D-IT光谱临界中间地区。我们表明,通过在富含Ga-富含(4x6)重建表面上生长的样品上的优化热退火,实现了在中间涂层附近的D-IT的显着减少。 (c)2010年美国物理研究所。 [DOI:10.1063 / 1.3488813]

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