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Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development

机译：应用SEM，EPMA和EBSD分析技术对微电子包装开发的焊点

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Tzu-Ting Chou; Rui-Wen Song; Jenq-Gong Duh;
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年度 2018
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1. Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique [J] . D. Chicot, K. Tilkin, K. Jankowski, Microelectronics & Reliability . 2013,第5期

机译：微压痕技术分析微电子封装中因蠕变和疲劳引起的焊点可靠性
2. Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging [J] . Mustafa Muhannad, Suhling Jeffrey C., Lall Pradeep Microelectronics & Reliability . 2016,第Jana期

机译：等温老化下微电子封装中无铅焊点疲劳行为的实验测定
3. An investigation of reliability of solder joints in microelectronic packages by high temperature moire method [J] . Haixia Shang, Jianxin Gao, P. Ian Nicholson, Microelectronics reliability . 2011,第5期

机译：高温莫尔条纹法研究微电子封装中焊点的可靠性
4. IDENTIFICATION OF CRYSTAL STRUCTURES AND ELEMENTAL COMPOSITION OF REACTIVE AIR BRAZED Ba_(0.5)Sr_(0.5)Co_(0.8)Fe_(0.2)O_(3-Δ)-Ag-14CuO JOINTS BY EBSD, EPMA AND ANALYTICAL TEM [C] . L.C. Ehle, S. Herzog, S. Richter, European workshop on modern developments and applications in microbean analysis . 2019

机译：EBSD，EPMA和分析TEM识别活性气钎焊Ba_（0.5）Sr_（0.5）Co_（0.8）Fe_（0.2）O_（3-Δ）-Ag-14CuO接头的晶体结构和元素组成
5. Mechanical and thermomechanical stability issues of 96.5SN-3.5AG solder joints in microelectronic packages. [D] . Yang, Hong. 1998

机译：微电子封装中96.5SN-3.5AG焊点的机械和热机械稳定性问题。
6. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint [O] . Sang-Yeob Lee, Jong-Hyuk Lee 2010

机译：焊接工艺和间隙距离对Ni-Cr合金焊接接头抗拉强度的影响
7. Establishment of Estimate Methods on Impact Strength of Lead-Free Solder Joints in BGA Packages (1) Dependence of Failure Modes of Solder Joints under Impact Load on Strain of PWB [O] . Akihiro Yaguchi, Hisashi Tanie, Yasuhiro Naka, 2010

机译：建立对BGA封装中无铅焊点的影响力的估计方法（1）抗衰式焊接损失模式的依赖性损失载荷株的依赖性损失载荷株对PWB菌株的影响

Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development

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