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Integration of thin film bulk acoustic resonators onto flexible liquid crystal polymer substrates

机译:将薄膜体声谐振器集成到柔性液晶聚合物基板上

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摘要

Thin film bulk acoustic resonators (FBARs) have been directly integrated on liquid crystal polymer (LCP) substrates for application to the field of flexible electronics. Particular developments required were chemo-mechanical polishing for LCP roughness reduction to enable growth of high quality ZnO films and a through substrate deep reactive ion etch process. Q values of up to 126 and 78 for series and parallel resonances combined with an electromechanical coefficient ∼ 6.7% were achieved. Further device development is needed but this performance is already sufficient for some chemical/biological sensing applications.
机译:薄膜体声波谐振器(FBAR)已直接集成在液晶聚合物(LCP)基板上,用于柔性电子领域。需要进行的特殊开发是用于降低LCP粗糙度的化学机械抛光,以实现高质量ZnO薄膜的生长以及贯穿衬底的深层反应性离子蚀刻工艺。串联和并联谐振的Q值分别高达126和78,机电系数约为6.7%。需要进一步的设备开发,但是这种性能对于某些化学/生物传感应用已经足够了。

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