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Integration of thin film bulk acoustic resonators onto flexible liquid crystal polymer substrates

机译:将薄膜体声谐振器集成到柔性液晶聚合物基板上

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摘要

Thin film bulk acoustic resonators (FBARs) have been directly integrated on liquid crystal polymer (LCP) substrates for application to the field of flexible electronics. Particular developments required were chemo-mechanical polishing for LCP roughness reduction to enable growth of high quality ZnO films and a through substrate deep reactive ion etch process. Q values of up to 126 and 78 for series and parallel resonances combined with an electromechanical coefficient (k_t~2) ~6.7% were achieved. Further device development is needed but this performance is already sufficient for some chemical/biological sensing applications.
机译:薄膜体声波谐振器(FBAR)已直接集成在液晶聚合物(LCP)基板上,用于柔性电子领域。需要进行的特殊开发是用于降低LCP粗糙度的化学机械抛光,以实现高质量ZnO薄膜的生长以及贯穿衬底的深层反应性离子蚀刻工艺。对于串联和并联谐振,结合机电系数(k_t〜2)〜6.7%,可获得高达126和78的Q值。需要进一步的设备开发,但是这种性能对于某些化学/生物传感应用已经足够了。

著录项

  • 来源
    《Microelectronic Engineering》 |2011年第6期|p.1006-1009|共4页
  • 作者单位

    Microsystems and Nanotechnology Centre, Cranfield University. Cranfield, Bedfordshire. UK;

    Microsystems and Nanotechnology Centre, Cranfield University. Cranfield, Bedfordshire. UK;

    Microsystems and Nanotechnology Centre, Cranfield University. Cranfield, Bedfordshire. UK;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    fbar; flexible electronics; lcp; rf mems;

    机译:fbar;柔性电子产品;lcp;rf内存;

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