Semiconductor Measurement Technology: HOTPAC. Programs for Thermal AnalysisIncluding Version 3.0 of the TXYZ Program, TXYZ30, and the Thermal MultiLayer Program, TML

摘要

This report presents and discusses a number of recent developments in the steady-state thermal analysis of multiple-layer structures. These include: (1) analytical evaluation of line and area average temperatures, and (2) a recursion relation technique for calculating the steady-state surface temperature of a multilayer structure with an arbitrary number of layers. The application of the analytic averaging to the TXYZ code is incorporated in the updated code, TXYZ30, while the multilayer recursion relation solution along with analytic averaging are included in the Thermal Multilayer code, TML. Both of these are contained in the HOTPAC software package. The first part of this report contains a discussion of the general elements of the multiple-layer thermal model. This is presented in some detail for the case of the Kokkas three-layer problem and the associated TXYZ code. The previous update of the code, TXYZ20, is also discussed.