Semiconductor Measurement Technology: Version 2.0 of the TXYZ Thermal Analysis Program: TXYZ20.

摘要

The TXYZ computer program has been used for a number of years for the thermal analysis of semiconductor devices and packages. The program makes use of the closed form, Fourier series solution of the steady-state heat flow equation for the general case of a rectangular three-layer structure with multiple heat sources on the top surface. TXYZ provides for the calculation of the temperature at any set of points in the structure and has proven useful for the determination of the steady-state temperature distribution of semiconductor chips and packages. The report presents TXYZ20 (TXYZ Version 2.0) which is a revised and updated version of the original TXYZ program. The TXYZ20 program incorporates more flexible handling of input data, assignment of positive or negative noninteger weights to the various heat sources or heat sinks, and improved evaluation of limiting forms in the code. The first part of the report consists of a discussion of the general elements in the TXYZ code and the particular changes which have been made to it to obtain TXYZ20. The second part of the report contains a discussion of several examples of the running of the code. Several annotated input data files are presented and discussed to show both the increased flexibility of the input data and the actual use of the updated code. Running the TXYZ20 code for one of the input files provides a benchmark for several machines.