Laser Deposition for IC Mask Microfault Repair

摘要

Several types of laser deposition were investigated with the goal of developing a new method of repairing transparent microfaults in IC masks. Initial results using laser curing of organometallic resinates were promising and the technique was emphasized. The metallo-organic formulation was applied to sodalime glass substrates using photoresist spin-on techniques and locally cured with a cw CO2 laser. The unreacted film was removed with solvent. The resulting films were adherent and opaque. For laser spot sizes of approximately 600 micron diameter, film dimensions of less than 40 microns were produced under appropriate irradiation conditions. It is noted that careful choice of irradiation parameters should enable deposition of areas of less than 5 microns using a CO2 laser with submicron film dimensions possible with shorter wavelength laser sources.