Effects of Substrate Deformation and Sip Thickness on Tile/Sip Interface Stresses for Shuttle Thermal Protection

摘要

A nonlinear analysis was used to study the effects of substrate deformation characteristics and strain isolator pad (SIP) thickness on TILE/SIP interface stresses for the space shuttle thermal protection system. The configuration analyzed consisted of a 5.08 cm thick, 15.24 cm square tile with a 12.7 cm square SIP footprint bordered by a 1.27 cm wide filler bar and was subjected to forces and moments representative of a 20.7 kPa aerodynamic shock passing over the tile. The SIP stress deflection curves were obtained after a 69 kPa proof load and 100 cycles conditioning at 55 kPa. The TILE/SIP interface stresses increase over flat substrate values for zero to peak substrate deformation amplitudes up to 0.191 cm by up to a factor of nearly five depending on deformation amplitude, half wave length, and location. Stresses for a 0.23 cm thick SIP found to be up to 60 percent greater than for a 0.41 cm thick SIP for identical loads and substrate deformation characteristics. A simplified method was developed for approximating the substrate location which produces maximum TILE/SIP interface stresses.