THERMALLY CONDUCTIVE MATERIAL, HEAT DISSIPATION SUBSTRATE USING IT, AND MANUFACTURING METHOD OF HEAT DISSIPATION SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To solve the problem of greatly limited use of a conventional heat dissipation substrate which uses a crystalline resin and is hardly usable for a circuit board and the like requiring predetermined shock resistance, since the crystalline resin itself is hard and brittle.;SOLUTION: A thermally conductive material 17 comprising an epoxy resin containing 40 vol.% or more of a crystalline epoxy resin, a curing agent, a thermoplastic resin in an amount of 0.3-5.0 vol.% of the total amount of the epoxy resin and the curing agent, and an inorganic filler in an amount of 70-88 vol.% of the epoxy resin, is used for a thermally conductive insulating layer 11, and thereby the heat dissipation substrate is obtained excellent in both of high thermal conductivity and high shock resistance.;COPYRIGHT: (C)2009,JPO&INPIT