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TEM Analysis of Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers.

机译：金属中间层结合扩散粘结碳化硅陶瓷的TEm分析。

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Ozaki, T.; Tsuda, H.; Halbig, M. C.; Singh, M.; Hasegawa, Y.; Mori, S.; Asthana, R.;
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年度 2017
页码 1-18
总页数 18
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正文语种 eng
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1. Electrophoretic deposition [EPD] applied to reaction joining of silicon carbide and silicon nitride ceramics [J] . P. A. LESSING, A. W. ERICKSON, D. C. KUNERTH Journal of Materials Science . 2000,第12期

机译：电泳沉积[EPD]用于碳化硅和氮化硅陶瓷的反应连接
2. TEM Studies on Microstructural Evolution in Hot Pressed Silicon Carbide Ceramics [J] . Abhijit Ghosh, Abdul Gulnar, R.K. Fotedar BARC Newsletter . 2003,第237期

机译：热压碳化硅陶瓷显微组织演变的TEM研究
3. The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics [J] . Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2020,第9a12期

机译：SICP / AG-CU-TI杂交胶带的制备及应用在碳化硅陶瓷的连接中
4. TEM ANALYSIS OF DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS [C] . T. Ozaki, Y. Hasegawa, H. Tsuda International Conference on Advances Ceramics and Composites . 2018

机译：使用金属夹层连接扩散粘合的碳化硅陶瓷的TEM分析
5. Joining of silicon nitride ceramics to itself and to other materials using chemically compatible interlayers. [D] . Gopal, Mani. 1997

机译：使用化学兼容的中间层将氮化硅陶瓷结合到自身和其他材料上。
6. The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics [O] . Yurong Chen, Honghua Su, Jingyuan He, 2021

机译：磁碳化硅陶瓷纵向扭转耦合超声振动磨削扭转振动的影响
7. Tem Analysis of Interfaces in Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers [O] . T. Ozaki, Y. Hasegawa, H. Tsuda, 2017

机译：使用金属中间层连接扩散粘合的碳化硅陶瓷界面的TEM分析
8. TEM Analysis of Interfaces in Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers. [R] . Ozaki, T., Tsuda, H., Halbig, M. C., 2016

机译：金属中间层结合扩散粘结碳化硅陶瓷界面的TEm分析。

TEM Analysis of Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers.

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