Experiments of Device Failures in a Spatial Power-Combining Array

摘要

The performance of a spatial power-combining array with device failure isinvestigated. Experimental results show that the array still combines the power in the broadside direction when the DC open-circuit failure occurs. Analysis of measured radiation patterns indicated that the power radiated from the patch antenna attached to the failed device is much smaller than the power radiated from other patch antennas. The effects of the chip resistor and the RF impedance of failed device are discussed. Quasi-optical power-combining technology has been proven to be a very efficient method of achieving high power from solid state oscillators at high frequencies (l), (2). As the number of devices increase, however, device failures are very likely to occur during the fabrication process or normal operation.These device failures may ruin the performance of circuit. Therefore, it is necessary to investigate the effect of device failures in power-combining arrays. (KAR) P. 2.