Non Destructive Characterization, Inspection, Failure Analysis of Advanced Components and Sensors With a High Resolution & High Contrast Microtomography (microCT) System; Conference paper

摘要

3D X-ray microtomography (microCT) can non-destructively characterize, inspect and solve many failure analysis problems associated with the manufacture of advanced materials, components, finished products, sensors for the military and industry. Conventional microCTs however, have spatial resolution limitation (typically of the order of a few microns to tens of microns) and poor contrast with low Z (atomic number) materials. We describe the role of a novel high resolution and high contrast microCT to visualize defects at the micron and sub-micron length scales, typically encountered in the manufacturing and development of advanced sensors and polymer composites. Examples shown include semiconductor packages, low temperature co-fire ceramics (LTCC), and Laser fusion targets spheres.