首页> 外文期刊>Acta Physica Polonica >Non-Destructive Characterization, Inspection, Failure Analysis of Advanced Components and Sensors with a High Resolution and High Contrast Micro XCT System
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Non-Destructive Characterization, Inspection, Failure Analysis of Advanced Components and Sensors with a High Resolution and High Contrast Micro XCT System

机译:高分辨率和高对比度Micro XCT系统对高级组件和传感器进行无损表征,检查和故障分析

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摘要

3D X-ray microtomography (Micro XCT) can non-destructively characterize, inspect and solve many failure analysis problems associated with the manufacture of advanced materials, components, finished products, sensors for the military and industry. Our novel high resolution and high contrast micro CT can be used to visualize defects at the micrometer and sub-micrometer length scales, typically encountered in the manufacturing and development of advanced sensors and polymer composites.
机译:3D X射线显微断层照相术(Micro XCT)可以无损地表征,检查和解决与军事和工业用先进材料,零件,成品,传感器制造相关的许多故障分析问题。我们新颖的高分辨率和高对比度的微型C​​T可用于可视化微米级和亚微米级的缺陷,这在高级传感器和聚合物复合材料的制造和开发中通常会遇到。

著录项

  • 来源
    《Acta Physica Polonica》 |2009年第suppla期|S.192-S.193|共2页
  • 作者

    S.H. LAU; A. KOWALCZYK;

  • 作者单位

    Xradia, Inc., Concord, CA 94520, USA;

    LOT-Oriel, 41-710, Ruda Slaska, Poland;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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