Power Packaging of Spray-Cooled SiC Devices for High Temperature and High Voltage Operation: Final Report; Final rept. 1 Apr 2004-31 May 2008

摘要

Main objective was developing the foundation for designing sprayed cooled power packages for semiconductors like silicon-carbide devices capable of high temperature and voltage operation. Research addressed: (1) Understanding of the heat transfer phenomenon during spray cooling under phase change; (2) Packaging materials for high temperature and spray cooling or jet impingement; (3) A scaled down spray-cooled power package of a power conversion module; and (4) New electric topologies of power conversion modules for integration with spray-cooling solutions. Main conclusions were: (1) Quick replacement of hot liquid by cold liquid (i.e., transient conduction) is main mechanism enabling high heat fluxes; (2) Jet impingement without nozzles provides cost effective solutions; (3) Several high temperature active metal brazing materials suitable for high temperature die attach but requiring more research to ensure proper chemical behavior; (4) A double-sided power package providing minimized volumetric footprint for the spray box and integrates the power electronic systems; and (5) Several new electric topologies of power conversion modules.