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Multichip Technology - A Method of Increasing the Packing Density While Simultaneously Decreasing the Assembly Expense.

机译：多芯片技术 - 一种提高装箱密度同时降低装配费用的方法。

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作者
Hanke, H. J.;
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年度 1976
页码 1-13
总页数 13
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Chips(Electronics); Microelectronics; Packing density; Computers; Metal oxide semiconductors; Savings; Cost benefits; Ion implantation; Bipolar systems; Switching; East Germany; Printed circuit boards; Translations;

机译：芯片（电子）;微电子;封装密度;计算机;金属氧化物半导体;节省;成本效益;离子注入;双极系统;开关;德国东部;印刷电路板;翻译;

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2. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [J] . Ji-Chel Bea, Mariappan Murugesan, Hideto Hashiguchi, Micromachines . 2016,第10期

机译：带有毛细管自组装的氧化物-氧化物热压直接键合技术，用于多芯片至晶圆异质3D系统集成
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5. Increased density of class I major histocompatibility complex antigens and decreased density of T-cell differentiation antigens in the early stages of T-cell activation [D] . 松井良樹 1988

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6. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [O] . Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, 2016

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7. Multichip Technology - A Method of Increasing the Packing Density While Simultaneously Decreasing the Assembly Expense [O] . H. J. Hanke 1976

机译：多芯片技术 - 一种增加包装密度的方法，同时降低装配费用

Multichip Technology - A Method of Increasing the Packing Density While Simultaneously Decreasing the Assembly Expense.

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