Production Process Development for Polyimide-Acrylic Materials for Flexible Printed Circuitry.

摘要

The results of a successfully concluded NAV-SEA sponsored program performed by General Dynamics, Pomona, in testing, process development, and fabrication of multilayer Flexible Printed Wiring (FPW) using acrylic adhesive are reported. These acrylic adhesives were obtained in various forms, as copper and/or polyimide laminates and cast film. Based on the findings of this investigation, change-over to these acrylic-polyimide materials is recommended for all continuing FPW fabrication programs, in order to improve yields, improve product reliability, and reduce both processing and overall costs. The program objective of choosing a material/process system which provides a significant reduction in fabrication cost, with an improvement in quality of the product as its acceptance criteria was achieved. This program included testing and fabrication of materials, two layer test pattern FPW, four layer test pattern FPW and a four layer pilot lot FPW consisting of multiple test patterns including an actual tactical missile FPW prototype part.