CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, PROCESS FOR PRODUCTION OF PHOSPHORUS-CONTAINING PHENOL, RESIN COMPOSITION FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, RESIN COMPOSITION FOR FLEXIBLE WIRING BOARD, RESIN COMPOSITION FOR ENCAPSULATING MATERIAL OF SEMICONDUCTOR, AND RESIN COMPOSITION FOR INTERLAYER INSULATING MATERIAL FOR BUILD-UP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in flame retardancy and heat resistance of a cured article, and achieving extremely low linear expansion coefficient; a cured article thereof; a process for production of phosphorus-containing phenols utilized therefor; a resin composition for a printed wiring board using the curable resin composition; a printed wiring board; a resin composition for a flexible wiring board; a resin composition for encapsulating material for a semiconductor; and a resin composition for an interlayer insulating material for a build-up substrate.;SOLUTION: An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is reacted with an organic phosphorus compound (a2) having a P-H or P-OH group in its molecular structure, and the resulting reaction product is reacted with a phenol resin (a3) having a bis(hydroxyphenylene)sulfone structure to produce phosphorus-containing phenols (A). The curable resin composition includes the phosphorus-containing phenols (A) and an epoxy resin (B) as essential components.;COPYRIGHT: (C)2012,JPO&INPIT