Thermal Stress Analysis of Glass Seals in Microelectronic Packages Under Thermal Shock Conditions.

摘要

The objective of this effort was to develop a mathematical model for predicting the transient thermal stresses that occur in a typical annular lead-through glass seal of a microelectronic package during a thermal shock test. The study results show that the magnitude of the thermal stresses in the seal area depends upon the initial residual stresses that result from cooling the package to room conditions after the high temperature sealing process is completed. A computer program was developed to analyze the thermal stresses in any circular lead package while undergoing a thermal shock test. A method has been developed for predicting the stresses which are present in the lead-through seal area of a microelectronic package when subjected to a thermal shock.